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Along the rapid development of technologies like 5G and AIoT, semiconductor devices now contain ever more functionalities, using "system in a package" and "heterogeneous integrated package" methods to run at higher speed with more connection pins. Chroma's semiconductor test solutions address all the needs of SoC by offering various specific functions, such as high-speed digital testing, high performance power source, high fidelity and low noise mixed signal testing, CMOS image sensor testing, as well as true wireless stereo and radio frequency testing. Chroma has also developed series of PXIe instruments and software, leveraging the benefits of PXIe's size and flexibility to drive all your semiconductor innovations.
Quick Menu
SoC Test System
SoC/Analog Test System
Model 3650-S2
- 12 Universal slots for digital, analog and mixed-signal applications
- Up to 768 digital I/O and analog pins
- 50 / 100 MHz clock rate
- 100 / 200 Mbps (MUX) data rate
Wireless & RF Function Board
HDRF2
- VST*4 ; RF port*32
- Direct mount
- 8/16 sites test
- Wi-Fi、BT、Sub 6GHz、IOT、GPS、LoRa、NB-IoT
Advanced SoC Test System
Model 3680
- 24 interchangeable slots for digital, analog and mixed-signal applications
- Data rate up to 1Gbps
- Up to 2048 sites parallel test
- Up to 2048 digital I/O pins
Advanced SoC/Analog Test System
Model 3650
- Application coverage: PMIC, ADDA/Memory, Controller, MCU, and all sorts of consumer
- Expandable platform with up to 640 channels
- 50 / 100 MHz clock rate; 100 / 200 Mbps (MUX) data rate
- Varieties of high density options, ranging from analog, ADDA, mixed-signal, to TIA
Advanced SoC/Analog Test System
Model 3650-EX
- Application coverage: MCU, ADDA/Memory, Controller, PMIC, and all sorts of consumer
- Expandable platform with up to 1024 IO channels and 96 DPS
- 50/100 MHz, 200 MHz (MUX) Test Rate
- Varieties of high density options include VI45, PVI100, HDADDA and MRX
VLSI Test System
VLSI Test System
Model 3380P
- 100Mhz clock rate, 512 I/O channels (Max to 576 pins)
- Up to 512 sites Parallel testing
- Various VI source
- Flexible Architectures: Slot interchangeable I/O, ADDA, VI source
VLSI Test System
Model 3380D
- 100 MHz clock rate, 256 I/O digital I/O pins
- Up to 256 sites Parallel testing
- Various VI source
- Flexible HW-architecture (Interchangeable I/O, VI, ADDA)
VLSI Test System
Model 3380
- 100Mhz clock rate, 1024 I/O channels (Max to 1280 pins)
- Up to 1024 sites Parallel testing
- Various VI source
- Flexible Architectures: Slot interchangeable I/O, ADDA, VI source
High Voltage Device Power Supply
Model 33021
- Max. 48V DC output with 2 channels per card
PXIe Programmable Device Power Supply
Model 33020
- High channel density with 8 channels per card
Universal Relay Driver Control
Model 33011
- PXIe based universal relay control
- 32CH direct relay drivers
- 2 lanes of SPI relay control interface
High Speed PXIe Digital IO Card
Model 33010
- Standard PXIe bus connector
- 100MHz maximum clock rate
- 32 channels per board
IC Pick & Place Handler
Single Site Test Handler
Model 3210
- SLT handler
- Ideal for early device design and engineering validation
- Compatible kit to scale-up production
- ATC Tri-temp -40℃ to 150℃ IC test
Hybrid Single Site Test Handler
Model 3110
- FT and SLT compatible handler
- Compatible kit to scale-up production
- ATC Tri-temp -40 to 150 ℃ IC test (Optional -55 to 150℃ , -70 to 150℃)
- Auto tray loading/unloading and device sorting capability
Full Range Active Thermal Control Handler
Model 3110-FT
- Temperature Test from -40~125℃
- Final Test or System Level Test
- 3x3mm~45x45mm Package
Tabletop Single Site Test Handler
Model 3111
- Tabletop design for smaller table space 60 cm2
- (2) Fixed JEDEC trays
- IC package size ranges: 5x5mm to 45x45mm
- Software configurable binning
RF Solution Integrated Handler
Model 3240-Q
The Chroma 3240-Q is a unique and innovative handler with integration of RF/Wireless isolation chamber.
Die Test Handler
Model 3112
- Reliable Pick&Place bare die test handler
- Multi-plate input and automated test sorting capability
- Omni-directional adjustable probe stage (X/Y/Z/θ)
- Stage remain die check function
Tri-Temp Octal Sites Handler
3160-C
- Advance thermal technology (Nitro TEC)
- Faster index time 0.6 sec
- Active thermal control and full range temperature
- Chamber less design
Octal Site Test Handler
Model 3180
- Up to x8 parallel test sites
- Up to 9000 UPH
- Temperature test from ambient ~150℃
Automatic System Function Tester
Model 3240
- Innovative handler for high volume/multi-site IC testing at system level.
- Test up to 4 devices in parallel at high temperature with ATC ranging from 50°C to 125°C.
Automatic System Function Tester
Model 3260
- Innovative handler for high volume/multi-site IC testing at system level.
- Test up to 6 devices in parallel at high temperature with ATC ranging from -40°C to 125°C.
Miniature IC Handler
Model 3270
Innovative handler for high volume/multisite miniature IC testing, especially for CIS Testing (CMOS Image Sensor), at system level.
Temperature Forcing System
Model 31000R Series
- -70°C to 150°C temperature range
- Cost competitive
- Compact footprint
- Semi-automation
- Liquid-free Operation
Metrology System
2D/3D Wafer Metrology System
Model 7980
Chroma 7980 2D/3D Wafer Metrology System is powered by patented BLiSTM technology to provide nanoscale nondestructive and rapid surface profile measurement and analysis. The system is suitable for up to 12" wafer with EFEM and SECS/GEM.
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