Along the rapid development of technologies like 5G and AIoT, semiconductor devices now contain ever more functionalities, using “system in a package” and “heterogeneous integrated package” methods to run at higher speed with more connection pins. Chroma’s semiconductor test solutions address all the needs of SoC by offering various specific functions, such as high-speed digital testing, high performance power source, high fidelity and low noise mixed signal testing, CMOS image sensor testing, as well as true wireless stereo and radio frequency testing. Chroma has also developed series of PXIe instruments and software, leveraging the benefits of PXIe’s size and flexibility to drive all your semiconductor innovations.

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SoC 测试系统

SOC/模拟测试系统 Model3650-S2
Model 3650-S2
  • 12个通用插槽,全部插槽都可配置数字、模拟和混合信号集成电路测试单板使用
  • 多达768个数字和模拟测试通道
  • 时钟频率: 50 / 100 MHz
  • 数据速率: 100 / 200 Mbps (MUX)
先进SoC/模拟测试系统 Model3680
Model 3680
  • 24个可互换插槽,用于数字、模拟和混合信号应用
  • 150 Mbps数据速率(muxed模式最高最高1Gbps)
  • 最高512 sites并行测试
  • 多达2048个数字通道管脚
SoC/Analog测试系统 Model3650
SoC/Analog 测试系统
Model 3650
  • Application coverage: PMIC, ADDA/Memory, Controller, MCU, and all sorts of consumer
  • Expandable platform with up to 640 channels
  • 50 / 100 MHz clock rate; 100 / 200 Mbps (MUX) data rate
  • Varieties of high density options, ranging from analog, ADDA, mixed-signal, to TIA
SoC/Analog测试系统 Model3650-EX
SoC/Analog 测试系统
Model 3650-EX
  • Application coverage: MCU, ADDA/Memory, Controller, PMIC, and all sorts of consumer
  • Expandable platform with up to 1024 IO channels and 96 DPS
  • 50/100 MHz, 200 MHz (MUX) Test Rate
  • Varieties of high density options include VI45, PVI100, HDADDA and MRX

VLSI 测试系统

VLSI测试系统 Model3380P
VLSI 测试系统
Model 3380P
  • 50/100 MHz测试频率、50/100 Mbps数据速率
  • 512数字信道管脚 (最高可至 576数字信道管脚)
  • 并行测试可达512 sites同测数
  • 多样弹性VI电源
VLSI测试系统 Model3380D
VLSI 测试系统
Model 3380D
  • 50/100 MHz测试频率、50/100 Mbps数据速率
  • 256数字信道管脚
  • 并行测试可达256 sites同测数
  • 多样弹性VI电源
VLSI测试系统 Model3380
VLSI 测试系统
Model 3380
  • 50/100 MHz测试频率、50/100 Mbps数据速率
  • 1024 I数字信道管脚 (最高1280 数字信道管脚)
  • 高达1024 sites并行测试
HighVoltageDevicePowerSupply Model33021
  • PXI Systems Alliance
High Voltage Device Power Supply
Model 33021
  • Max. 48V DC output with 2 channels per card
UniversalRelayDriverControl Model33011
  • PXI Systems Alliance
Universal Relay Driver Control
Model 33011
  • PXIe based universal relay control
  • 32CH direct relay drivers
  • 2 lanes of SPI relay control interface
HighSpeedPXIeDigitalIOCard Model33010
  • PXI Systems Alliance
High Speed PXIe Digital IO Card
Model 33010
  • Standard PXIe bus connector
  • 100MHz maximum clock rate
  • 32 channels per board

IC测试分类机 (IC Test Handler)

双用单站测试分类机 Model3110
Model 3110
运用Pick & Place技术,将待测芯片由进料舱移至测试区,再依测试结果进行分类。不但适用于系统功能检测,也同时具备终端电性测试的能力。
三温测试分类机 Model3110-FT
  • CE Mark
Model 3110-FT
  • Temperature Test from -40~125℃
  • Final Test or System Level Test
  • 3x3mm~45x45mm Package
桌上型单站测试分类机 Model3111
  • CE Mark
Model 3111
  • 桌上型设计仅占较小空间
  • 可放置两个JEDEC料盘
  • 支持5x5mm到45x45mm芯片尺寸
  • 可由软件接口设定分类数
  • 测试头内建气室,可吸收及减缓下压触力冲击
无线射频分类机 Model3240-Q
Model 3240-Q
晶片测试分类机 Model3112
Model 3112
三温终端测试分类机 3160-C
  • CE Mark
  • 先进的温控技术(Nitro-TEC 氮气温度控制器)
  • 更快的Index Time(0.6 sec)
  • 主动式温度控制并且提供更全面的测试温度区间
  • Chamber Less的设计
  • 支持更多样化测试Sites的选择(1/2/4 sites)
八站逻辑测试分类机 Model3180
  • CE Mark
Model 3180
  • 具有八个平行测试站点
  • 9Kpcs产能
  • 温度测试范围从常温到高温150℃
三温系统板测试分类机 Model3260C
Model 3260C
  • 高速可靠Pick&Place分类机
  • 同步吸嘴双取与双放设计
  • IC残留检测功能、通用治具设计
  • Nitro TEC主动式温控技术导入
  • 更快速的升降温反应速度
自动化系统功能测试机 Model3240
Model 3240
  • 4-sites
  • 可供多组PCB level平行测试的大量生产机具
自动化系统功能测试机 Model3260
Model 3260
  • 6-sites
  • 可供多组PCB level平行测试的大量生产机具
微型IC测试分类机 Model3270
Model 3270
适合CMOS 影像感应元件 (CMOS Image Sensor, CIS)量产所需
CobraTemperatureForcingSystemforATE/SLTTestApplications Model31000R
Cobra Temperature Forcing System for ATE/SLT Test Applications
Model 31000R
  • Temperature range of -40°C to 150°C
  • Compact footprint
  • Self-contained – No external chiller required
  • Liquid-free Operation