Chroma ATE

Behind Every Optics Breakthrough

Chroma's Reliability Test Solutions
for SiPh/PIC Manufacturing

As silicon photonics (SiPh) and photonic integrated circuit (PIC) technology continues to evolve, new optoelectronic devices emerge to meet the demand for higher bandwidth, lower power consumption, and reduced latency in high-speed data communication applications like network switching and high-performance computing (HPC). However, despite their sophistication, these devices do not inherently have the reliability needed to withstand ever harsher operational environments, let alone when deployed at scale. Without rigorous reliability testing, potential failures and performance degradation could lead to costly downtime and reduced device lifespan.

 
 

Packaging Trends Increase Stress Factors for PIC Devices

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Among the various optoelectronic PIC components used in the field, active devices such as laser diodes, optical modulators, and photodiodes are particularly prone to reliability issues due to increasingly demanding operation scenarios. The projected road map for optics packaging —from conventional pluggable optics toward state-of-the-art co-packaged optics (CPO)—entails aggressive shrinkage of PIC chiplet sizes. This results in higher power density concentrated in small areas, creating a stressful thermal environment for these miniaturized PIC devices.

Chroma 58623 Photonics IC Assembly and Sorting System
Photonics IC Assembly and Sorting System
Chroma 58623

Key Reliability Challenges for Active SiPh/PIC Devices

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Compound semiconductor-based laser diodes are the typical light source used for PICs. Their relatively immature manufacturing process (compared to silicon (Si) processing) makes them susceptible to microcracks during facet cleaving. The subsequently formed dark line defects (DLDs) sprawl along the crack plane until the laser diode eventually fails in its entirety.

Another widely deployed active PIC device is the optical modulator. Phase devices such as micro-ring modulators are inherently sensitive to temperature variations and need heaters to compensate for temperature shifts induced by thermal agitation. These heaters are typically fabricated through a metallization process, which is cost-effective but comes at the price of a metal-specific reliability issue: electromigration, a metallic degradation phenomenon that occurs when current density scales to MA/cm2 levels.

Lastly, photodiodes used in PIC receiver subassemblies are also vulnerable to reliability issues. High-speed germanium (Ge) photodiodes in particular suffer from lattice mismatch between Ge deposition and Si substrate, introducing defects that contribute to dark current degradation. For all these devices, stringent reliability testing can deliver substantial benefits in terms of mitigating failure risks, cutting capex, and reducing cost-of-ownership.

Chroma's Reliability Test Solutions for SiPh/PIC Manufacturing

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Chroma ensures customer success by aiding in the development of innovative technology products while maintaining performance and quality standards. Chroma's 58604 and 58606 Series of PIC Burn-in and Reliability Test Systems offer aging, reliability, and lifetime testing for a variety of photonic chip components such as laser diodes, photodiodes, and optical modulators. These systems boast a testing capacity of up to 1,792 channels with 28 independent temperature control modules, each providing bi-polar voltage and current outputs and measurements across 64 SMU channels.

High Density Laser Diode Burn-in & Reliability Test System
Chroma 58604-HD↗

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Chroma 58604-HD High Density Laser Diode Burn-in & Reliability Test System

· Burn-In, reliability, and life test
· ACC and APC control modes
· Independent channel driving and measurement
· Proprietary spike-free SMU design
· Up to 500mA single-channel current driving
· Precise temperature control up to 125ºC
· Modular design for maximum convenience and easy maintenance
· Automatic software reconnection
· Comprehensive ESD protection

High Density & High Power Laser Diode Burn-In & Reliability Test System
Chroma 58605-HD

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Chroma 58605-HD High Density & High Power Laser Diode Burn-In & Reliability Test System

· Burn-In, reliability, and life test
· ACC and APC control modes
· Independent channel driving and measurement
· Proprietary spike-free SMU design
· Up to 2,500mA single-channel current driving
· Precise TEC temperature control
· Modular design for maximum convenience and easy maintenance
· Automatic software reconnection
· Comprehensive ESD protection

Photodiode Burn-in and Reliability Test System
Chroma 58606↗

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Chroma 58606 Photodiode Burn-in and Reliability Test System

· Burn-In, reliability and life test
· Dark Current and Breakdown Voltage
· 256 channels Bi-polar device source per drawer
· High bias source to 80 volts
· Spike free source for device protection
· Programmable output for each source
· Independent sub drawer start/stop control
· Per carrier temperature control
· High Precision probing for die level burn-in

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