Facility

Production Space: 142,330 ft² (Four stories)

Assembly Line: AI Line, SMD Line, PCBA Line, Module Line, Cabinet System Line, Mechatronics System Line

Production Space: 106,750 ft² (Two stories)

Assembly Line: Mechatronics System Line

Production Space: 35,500 ft² (One story)

Assembly Line: Module Assembly Line

Equipment:

• Screen Printer
• Adhesive Dispenser
• Compact-Sized Chip Mounter
• Compact-Sized Fine-Pitch Mounter
• AOI Inspection
• N2 Reflow Oven
• PCB Size
  Line1: (Max) 750*460mm
  Line2: (Max) 460*360mm 
• Range of Component
  Line1: 0603(0201") Chip ~ Φ43mm ~ Φ150mm
  Line2: 0402 (01005") Chip ~ Φ74mm or 50x150mm
• Placement tact time (Each M/C)
  Line1: Chip 18,000 CPH, IC 2,400 CPH
  LIne2: Chip 23,300 CPH, IC 4,860 CPH
• Reflow 
  Line1: 10 Heat Zones, 3 Cooling Zones
  Line2: 11 Heat Zones, 2 Cooling Zones

Equipment:

• Component Sequencer
• Component Inserter
• PCB Size: (Max) 480*400mm
• Insertion rates: 25000 CPH

• Equipment: X-Ray
• Maximum current: 1000uA 
• Detail detect ability: down to 1 micron