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Package Level Test
Photonics Module Test System
Model 58625
- All-in-one test system
- Flexible test station arrangement
- Precise temperature control -20~85℃
- Large beam angle measurement
Photodiode Burn-in and Reliability Test System
Model 58606
- Burn-in, reliability and life test
- Dark Current and Breakdown Voltage
- 256 channels Bi-polar device source per drawer
- High bias source to 80 volts
Laser Diode Burn-in and Reliability Test System
Model 58604
- Applicable for burn-in, reliability andlife testing
- ACC and APC burn-in modes
- Individual channel driving and measurement. Up to 500mA driving per channel
- Precise temperature control up to 125°C
- Individual module operation
Laser Diode Characterization System
Model 58620
- Full turnkey automated test for edge-emitting laser diodes
- High precision and large capacity carrier, interchangeable with other automated equipment
- Fully automated alignment for fiber-coupled tests
Laser Diode Reliability, Burn-In and Life-Test System
Model 58602
- Burn-In, Reliability and Life Testing
- Up to 4608 Channels
- Up to 20A per device
TO-CAN Package Inspection System
Model 7925
- It can inspect lens scratch, crack, particle and metal cap defect of TO-CAN package
- Defect criteria editor for versatile pass/fail criteria setting
- Throughput is higher than UPH 3600
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