The system uses white light interference measurement technique to perform nondestructive and rapid surface profile measurement and analysis, which is suitable for 12" wafer.
Use white light interference measurement technique
Modulized design
Various surface measurement parameters, such as sectional difference, included angle, area, dimension, roughness, waviness, film thickness and flatness
This website uses cookies to improve functionality and performance. By continuing to use this website, you are giving implied consent to the use of cookies on this website. For latest or related information, please check our privacy policy.