Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often integrated into production solutions for wafer probe test, burn-in and device or module characterization then reinforced with inspection, metrology, robotics, Industry 4.0 and more.

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Wafer Level Test

In-processWaferInspectionSystem Model7945
  • CE Mark
In-process Wafer Inspection System
Model 7945
  • Double side inspection (post-diced wafer)
  • Full color defect detection
  • Fast multi-computer image processing
  • Shared auto wafer loader
PhotonicsWaferProbingTestSystem Model58635Series
Photonics Wafer Probing Test System
Model 58635 Series
  • Up to 6" wafer
  • Support both QCW and CW operation
  • LIV test, Near Field test, Far Field test, LIV-λ & NF two-in-one test
WaferChipInspectionSystem Model7940
Wafer Chip Inspection System
Model 7940
  • Simultaneous double side color inspection
  • 6" wafer/8" inspection area
  • Automatic wafer alignment
  • Wafer shape/edge identification

Package Level Test

PhotonicsModuleTestSystem Model58625
Photonics Module Test System
Model 58625
  • All-in-one test system
  • Flexible test station arrangement
  • Precise temperature control -20~85℃
  • Large beam angle measurement
PhotodiodeBurn-inandReliabilityTestSystem Model58606
Photodiode Burn-in and Reliability Test System
Model 58606
  • Burn-in, reliability and life test
  • Dark Current and Breakdown Voltage
  • 256 channels Bi-polar device source per drawer
  • High bias source to 80 volts
LaserDiodeBurn-inandReliabilityTestSystem Model58604
  • CE Mark
Laser Diode Burn-in and Reliability Test System
Model 58604
  • Applicable for burn-in, reliability andlife testing
  • ACC and APC burn-in modes
  • Individual channel driving and measurement. Up to 500mA driving per channel
  • Precise temperature control up to 125°C
  • Individual module operation
LaserDiodeCharacterizationSystem Model58620
Laser Diode Characterization System
Model 58620
  • Full turnkey automated test for edge-emitting laser diodes
  • High precision and large capacity carrier, interchangeable with other automated equipment
  • Fully automated alignment for fiber-coupled tests
LaserDiodeReliability,Burn-InandLife-TestSystem Model58602
Laser Diode Reliability, Burn-In and Life-Test System
Model 58602
  • Burn-In, Reliability and Life Testing
  • Up to 4608 Channels
  • Up to 20A per device
TO-CANPackageInspectionSystem Model7925
TO-CAN Package Inspection System
Model 7925
  • It can inspect lens scratch, crack, particle and metal cap defect of TO-CAN package
  • Defect criteria editor for versatile pass/fail criteria setting
  • Throughput is higher than UPH 3600