As the technology of optoelectronic components is maturing, its applications are broadening as well. Take laser diodes for example, they are no longer limited to communication applications but have expanded into consumer products. Photonics test solutions mainly focus on testing optoelectronic components, such as photodiode, LED, EEL, and VCSEL. They can also apply to configurations from upstream to downstream processes, including wafer, laser bar, bare chip, CoS, and TO-CAN. Chroma's system integration technology uniquely combines automation equipment with precision current sources, temperature controllers, and automated optical measurement instruments to perform an array of electrical, optical power, wavelength, near-field and far-field optics, and other optoelectronic characteristic and aging tests.

Chroma offers precision instruments such as laser drivers, photodetector monitoring, and temperature controllers. These lab class instruments are often integrated into production solutions for wafer probe test, burn-in and device or module characterization then reinforced with inspection, metrology, robotics, Industry 4.0 and more.

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Wafer Level Test

In-processWaferInspectionSystem Model7945
  • CE Mark
In-process Wafer Inspection System
Model 7945
  • Double side inspection (post-diced wafer)
  • Full color defect detection
  • Fast multi-computer image processing
  • Shared auto wafer loader
PhotonicsWaferProbingTestSystem Model58635Series
Photonics Wafer Probing Test System
Model 58635 Series
  • Up to 6" wafer
  • Support both QCW and CW operation
  • LIV test, Near Field test, Far Field test, LIV-λ & NF two-in-one test
WaferChipInspectionSystem Model7940
Wafer Chip Inspection System
Model 7940
  • Simultaneous double side color inspection
  • 6" wafer/8" inspection area
  • Automatic wafer alignment
  • Wafer shape/edge identification

Package Level Test

PhotonicsModuleTestSystem Model58625
Photonics Module Test System
Model 58625
  • All-in-one test system
  • Flexible test station arrangement
  • Precise temperature control -20~85℃
  • Large beam angle measurement
PhotodiodeBurn-inandReliabilityTestSystem Model58606
Photodiode Burn-in and Reliability Test System
Model 58606
  • Burn-in, reliability and life test
  • Dark Current and Breakdown Voltage
  • 256 channels Bi-polar device source per drawer
  • High bias source to 80 volts
LaserDiodeBurn-inandReliabilityTestSystem Model58604
  • CE Mark
Laser Diode Burn-in and Reliability Test System
Model 58604
  • Applicable for burn-in, reliability andlife testing
  • ACC and APC burn-in modes
  • Individual channel driving and measurement. Up to 500mA driving per channel
  • Precise temperature control up to 125°C
  • Individual module operation
LaserDiodeCharacterizationSystem Model58620
Laser Diode Characterization System
Model 58620
  • Full turnkey automated test for edge-emitting laser diodes
  • High precision and large capacity carrier, interchangeable with other automated equipment
  • Fully automated alignment for fiber-coupled tests
LaserDiodeReliability,Burn-InandLife-TestSystem Model58602
Laser Diode Reliability, Burn-In and Life-Test System
Model 58602
  • Burn-In, Reliability and Life Testing
  • Up to 4608 Channels
  • Up to 20A per device
TO-CANPackageInspectionSystem Model7925
TO-CAN Package Inspection System
Model 7925
  • It can inspect lens scratch, crack, particle and metal cap defect of TO-CAN package
  • Defect criteria editor for versatile pass/fail criteria setting
  • Throughput is higher than UPH 3600