Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips, advanced packaging, high-performance computing (HPC), and AIoT—designed to meet the evolving demands of next-generation semiconductor testing.
Advanced Packaging 3D Metrology Solutions - Chroma 7980/7981
The Chroma 7980/7981 systems feature Chroma's patented BLiSTM technology, purpose-built for nanoscale critical dimension measurement. These systems incorporate application-optimized algorithms and user interfaces to deliver high-speed surface profiling and fast auto-focusing capabilities, along with large-area image stitching. They address key needs in advanced packaging processes such as TSV/VIA, RDL, probe mark inspection, overlay, and sub-micron surface profiling. Additionally, Chroma's inspection and in-situ AOI solutions like the Chroma 7961 enable real-time defect detection and inline process quality control.
AI-Driven Test Platform - Chroma 3680
When hardware innovation meets AI-enhanced software, a new era of automated test equipment emerges.
The Chroma 3680 platform is purpose-built to meet the demands of modern semiconductor testing, combining high-efficiency algorithms with a modular architecture to redefine flexibility and efficiency in test systems.
This platform features a unified and intelligent system architecture that enables real-time, accurate test program conversion—reducing migration time and manpower by over 80%. It addresses key pain points such as poor portability of legacy test programs and time-consuming debugging processes, supporting diverse chip architectures with a concrete and effective solution.
Chroma 3680 supports modular expansion to meet increasingly diverse future requirements, and can be equipped with the HDRF2 module for one-click activation of RF testing, greatly simplifying test setup. The overall platform is designed for high scalability and flexibility, enabling fast adaptation across different product lines, application needs, and test scales—streamlining both development and validation processes.
Tri-Temp System-Level Test Solutions
Chroma's 3100 and 3200 pick-and-place handler solutions, paired with the 31000R/31000K Series Temperature Forcing Systems, deliver a powerful, fully integrated platform to meet the unprecedented challenges of AI-era device testing.
The advanced 3110, 3200, 3200-HD, 3210, and 3260 pick-and-place systems feature industry-leading SLT testing solutions, including a high-precision contact force system, CVOT (Chroma Virtual Operation Tools) for intelligent yield optimization, integrated device protection features, and a universal change kit design for fast, flexible device conversion. These systems ensure superior test quality through scalable architecture that integrates seamlessly into both engineering and high-volume production environments.
The intelligent 31000R thermal solution provides a wide and stable temperature control range from –40°C to 150°C, with high-power dissipation capability up to 2,900 W. It features advanced thermal performance with direct phase-change cooling, intelligent power monitoring, and high-precision multi-zone control. This makes it ideal for AI, HPC, and thermally demanding automotive applications.
SuperSizer Nano-Particle Monitoring Systems
Powered by advanced aerosol particle measurement technology, the SuperSizer system delivers precise monitoring of nano-sized particles ranging from 3 nm to 20 nm, overcoming the limitations of conventional optical systems, especially bubble interference.
The SuperSizer II, V, VI, and VII generations have been widely adopted for real-time monitoring of critical wet chemicals such as CMP slurry, isopropyl alcohol (IPA), hydrogen peroxide/pure water, and ammonia solutions. The latest addition to the series, SuperSizer VIII, is purpose-built for hydrochloric acid monitoring—extending the system's capabilities into more aggressive chemistries.
By enabling in-line and real-time particle detection, the SuperSizer platform helps minimize wafer defects, ensure chemical purity, and improve overall process yield.
Visit Chroma at SEMICON Taiwan 2025
From September 10–12, Chroma ATE will exhibit at SEMICON Taiwan 2025 at the Taipei Nangang Exhibition Center, Hall 1, 1F (Booth K2876).
In addition to showcasing our wide-ranging portfolio of test solutions, Chroma will present at the Semiconductor Advanced Inspection and Metrology Forum. Our presentation "White-Light Interferometry Integration with Electromagnetic Simulation and Digital Light-Field Control for Advanced Packaging" will explore innovative applications of advanced packaging inspection and metrology technologies.
Join us at SEMICON Taiwan 2025 and connect with our team to exchange insights on the future of test and innovation.