Temperature Forcing System Model 31000R Series

Key Features
  • Compact footprint
  • Liquid-free operation*
  • Semi-automation
  • Software integration
  • High dissipative power without LN2
  • User friendly GUI
  • -70°C to 150°C temperature range*
  • Cost competitive
  • Direct phase change
  • Configurable rack mounting*
  • Universal Socketing Capability
  • Programmable temperature and pneumatics
  • Power monitoring to prevent thermal runaway
  • Thermal Sensing Diode feedback

* Call for availability

Targeted Applications

  • Automotive IC
  • Graphic Processors (GPU)
  • Application Processing Units (APU)
  • AI and data center
  • Aerospace and defense
  • Implantable medical devices
  • CPUs
  • ASICs
  • Memory Modules

The Temperature Forcing System Series is an advanced, compact, powerful temperature forcing system and is an adaptable solution to the ever-increasing thermal demands of post silicon validation and device characterization. With a temperature range from-70°C to 150°C thermal engine*, and combining all the benefits of mobility and quiet operation. It is designed primarily for SLT applications with long test times using manual device placement or automated test system.

With the rack system layout optimizes mass parallelism that can be easily set up and customized to specific user-defined specifications. Cobra Systems are equipped for next-generation product development for high wattage temperature-controlled road map demands. Prevention of thermal runaway and limiting board or device damages are handled by a Power Monitoring unit which is sold separately as needed and currently available only for SLT solutions.


Temperature Forcing System for ATE and SLT Test Applications

▲ SLT Configuration

▲ ATE Configuration



▲ ATE Configuration

▲ SLT Configuration (Single Head)

▲ SLT Configuration (Dual Head)


Product Inquiry

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All specifications are subject to change without notice.

Temperature Forcing System